1. Isingeniso SMD Packaging Technology
1.1 Incazelo kanye nesendlalelo se-SMD
Ubuchwepheshe bokupakisha be-SMD buwuhlobo lokupakishwa kwengxenye ye-elekthronikhi. I-SMD, emele i-Surface Mounted Device, iwubuchwepheshe obusetshenziswa kakhulu embonini yokukhiqiza izinto zikagesi ukuze kufakwe ama-chips esekethe ahlanganisiwe noma ezinye izingxenye ze-elekthronikhi ezizofakwa ngqo phezu kwe-PCB (Ibhodi Lesekhethi Eliphrintiwe).
1.2 Izici Eziyinhloko
Usayizi Omncane:Izingxenye ezipakishwe ze-SMD zihlangene, zivumela ukuhlanganiswa kokuminyana okuphezulu, okuzuzisayo ekuklameni imikhiqizo ye-elekthronikhi encane noma engasindi.
Isisindo Esilula:Izingxenye ze-SMD azidingi umkhondo, okwenza uhlaka lulonke lube lula futhi lufanele izinhlelo zokusebenza ezidinga isisindo esincishisiwe.
Izici Ezinhle Kakhulu Zemvamisa:Imikhondo emifushane kanye nokuxhumana ezingxenyeni ze-SMD kusiza ukunciphisa i-inductance nokumelana, kuthuthukise ukusebenza kwe-high-frequency.
Ifanele Ukukhiqizwa Okuzenzakalelayo:Izingxenye ze-SMD zifanele imishini yokubeka ezenzakalelayo, ukwandisa ukusebenza kahle kokukhiqiza nokuzinza kwekhwalithi.
Ukusebenza Okuhle Kokushisa:Izingxenye ze-SMD zithintana ngokuqondile nendawo ye-PCB, esiza ekulahlekeni kokushisa futhi ithuthukise ukusebenza kokushisa.
Kulula Ukulungisa Nokugcina:Indlela ye-surface-mount yezingxenye ze-SMD yenza kube lula ukulungisa nokushintsha izingxenye.
Izinhlobo zokupakisha:Ukupakishwa kwe-SMD kufaka phakathi izinhlobo ezahlukahlukene ezifana ne-SOIC, QFN, BGA, ne-LGA, ngayinye enezinzuzo ezithile nezimo ezisebenzayo.
Ukuthuthukiswa Kwezobuchwepheshe:Kusukela yethulwa, ubuchwepheshe bokupakisha be-SMD buye baba obunye bobuchwepheshe bokupakisha obujwayelekile embonini yokukhiqiza ugesi. Ngokuthuthuka kwezobuchwepheshe kanye nesidingo semakethe, ubuchwepheshe be-SMD buyaqhubeka nokuvela ukuze buhlangabezane nezidingo zokusebenza okuphezulu, osayizi abancane, nezindleko eziphansi.
2. Ukuhlaziywa kwe-COB Packaging Technology
2.1 Incazelo kanye nesendlalelo se-COB
Ubuchwepheshe bokupakisha be-COB, obumelela i-Chip on Board, buyindlela yokupakisha lapho ama-chips efakwa ngokuqondile ku-PCB (Printed Circuit Board). Lobu buchwepheshe busetshenziselwa ngokuyinhloko ukubhekana nezinkinga zokukhipha ukushisa kwe-LED futhi kuzuzwe ukuhlanganiswa okuqinile phakathi kwe-chip nebhodi lesifunda.
2.2 Umgomo Wezobuchwepheshe
Ukupakishwa kwe-COB kuhlanganisa ukunamathisela ama-chips angenalutho ku-substrate exhumanisayo kusetshenziswa izinto zokunamathisela eziqhutshwayo noma ezingaqhubeki, okulandelwa ukubopha ngocingo ukuze kusungulwe ukuxhumana kukagesi. Ngesikhathi sokupakisha, uma i-chip engenalutho ivezwa emoyeni, ingangcoliswa noma yonakaliswe. Ngakho-ke, izinto zokunamathisela zivame ukusetshenziselwa ukuhlanganisa i-chip nezintambo zokubopha, zenze "i-soft encapsulation."
2.3 Izici Zobuchwepheshe
I-Compact Packaging: Ngokuhlanganisa ukupakishwa ne-PCB, usayizi we-chip ungancishiswa kakhulu, izinga lokuhlanganisa linyuswe, umklamo wesifunda uthuthukisiwe, ubunkimbinkimbi besifunda buyehliswa, kanye nokuzinza kwesistimu kuthuthukiswe.
Ukuzinza Okuhle: Ukuthengiswa kwe-chip eqondile ku-PCB kuphumela ekudlidlizeni okuhle nokumelana nokushaqeka, kugcina uzinzo ezindaweni ezinokhahlo ezifana nezinga lokushisa eliphezulu nomswakama, ngaleyo ndlela kunwebe ukuphila komkhiqizo.
I-Thermal Conductivity Enhle Kakhulu: Ukusebenzisa izinto ezinamathelayo ezishisayo phakathi kwe-chip ne-PCB kuthuthukisa ngempumelelo ukuchithwa kokushisa, kunciphisa umthelela oshisayo ku-chip futhi kuthuthukise ubude besikhathi sokuphila kwe-chip.
Izindleko Eziphansi Zokukhiqiza: Ngaphandle kwesidingo sokuhola, iqeda izinqubo ezithile eziyinkimbinkimbi ezibandakanya izixhumi nemikhondo, ukunciphisa izindleko zokukhiqiza. Ukwengeza, ivumela ukukhiqizwa okuzenzakalelayo, ukwehlisa izindleko zabasebenzi kanye nokwenza ngcono ukusebenza kahle kokukhiqiza.
2.4 Izinyathelo zokuqapha
Kunzima Ukuyilungisa: Ukunamathisela okuqondile kwe-chip ku-PCB kwenza ukususwa kwe-chip ngayinye kungenzeki noma ukushintshwa kungenzeki, ngokuvamile okudinga ukushintshwa kwayo yonke i-PCB, kukhuphule izindleko kanye nobunzima bokulungisa.
Izinkinga Zokwethenjelwa: Ama-chips ashumekwe kuma-adhesives angonakala phakathi nenqubo yokususa, okungenzeka abangele ukulimala kwephedi futhi athinte ikhwalithi yokukhiqiza.
Izidingo Eziphakeme Zendawo Ezungezile: Inqubo yokupakisha ye-COB idinga indawo engenalo uthuli, i-static; uma kungenjalo, izinga lokuhluleka liyakhula.
3. Ukuqhathaniswa kwe-SMD ne-COB
Ngakho-ke, yimuphi umehluko phakathi kwalezi zindlela ezimbili zobuchwepheshe?
3.1 Ukuqhathaniswa Kokuhlangenwe nakho Okubonwayo
Izibonisi ze-COB, ezinezici zazo zomthombo wokukhanya ongaphezulu, zinikeza izibukeli umuzwa obonakalayo ongcono kakhulu nofanayo. Uma kuqhathaniswa nomthombo wokukhanya wephoyinti we-SMD, i-COB inikeza imibala egqame kakhudlwana kanye nokuphathwa kwemininingwane engcono, okuyenza ifaneleke kakhulu ukubukwa kwesikhathi eside, eduze.
3.2 Ukuqhathanisa Ukuzinza Nokugcinwa
Nakuba izibonisi ze-SMD kulula ukuzilungisa esizeni, zinokuvikeleka okuphelele okubuthaka futhi zingenwa kalula yizici zemvelo. Ngokuphambene, izibonisi ze-COB, ngenxa yedizayini yazo iyonke yokupakisha, zinamazinga aphezulu okuvikela, nokusebenza okungcono okungangenwa amanzi nokuvikela uthuli. Kodwa-ke, kufanele kuqashelwe ukuthi izibonisi ze-COB ngokuvamile zidinga ukubuyiselwa efekthri ukuze zilungiswe uma kwenzeka kwehluleka.
3.3 Ukusetshenziswa kukagesi kanye nokusebenza kahle kwamandla
Ngenqubo ye-flip-chip engavinjelwe, i-COB inomthombo wokukhanya ophezulu osebenza kahle, okuholela ekusetshenzisweni kwamandla okuphansi kokukhanya okufanayo, konga abasebenzisi ezindlekweni zikagesi.
3.4 Izindleko Nentuthuko
Ubuchwepheshe bokupakisha be-SMD busetshenziswa kakhulu ngenxa yokuvuthwa kwabo okuphezulu kanye nezindleko eziphansi zokukhiqiza. Nakuba ubuchwepheshe be-COB ngokwethiyori bunezindleko eziphansi, inqubo yabo yokukhiqiza eyinkimbinkimbi nezinga lesivuno esiphansi okwamanje kubangela izindleko zangempela eziphakeme uma kuqhathaniswa. Kodwa-ke, njengoba ubuchwepheshe buthuthuka namandla okukhiqiza anda, izindleko ze-COB kulindeleke ukuthi zehle nakakhulu.
4. Amathrendi Okuthuthukisa Ikusasa
I-RTLED uyingqalabutho kubuchwepheshe bokuboniswa kwe-COB LED. EyethuIzibonisi ze-COB LEDzisetshenziswa kabanzi kuzonke izinhlobo zemibukiso ye-LED yokuhwebangenxa yomphumela wabo omuhle kakhulu wokubonisa nokusebenza okuthembekile. I-RTLED izibophezele ekuhlinzekeni ngezixazululo zekhwalithi ephezulu, zokuma okukodwa ukuze kuhlangatshezwane nezidingo zamakhasimende ethu zemibukiso enencazelo ephezulu nokonga amandla nokuvikelwa kwemvelo. Siyaqhubeka nokuthuthukisa ubuchwepheshe bethu bokupakisha be-COB ukuze silethe amakhasimende ethu imikhiqizo encintisana kakhulu ngokuthuthukisa ukusebenza kahle komthombo wokukhanya nokunciphisa izindleko zokukhiqiza. Isikrini sethu se-COB LED asigcini nje ngokuba nomphumela omuhle kakhulu wokubuka nokuzinza okuphezulu, kodwa futhi singasebenza ngokuzinza ezindaweni ezihlukahlukene eziyinkimbinkimbi, sinikeze abasebenzisi ulwazi oluhlala isikhathi eside.
Emakethe yokubonisa i-LED yokuhweba, kokubili i-COB ne-SMD kunezinzuzo zabo siqu. Ngokukhula kwesidingo sezibonisi ezinencazelo ephezulu, imikhiqizo yokubonisa ye-Micro LED enokuminyana kwephikseli ephakeme kancane kancane izuza umusa emakethe. Ubuchwepheshe be-COB, obunezici zabo zokupakisha ezididiyelwe kakhulu, sebuphenduke ubuchwepheshe obubalulekile bokuthola ukuminyana kwephikseli ephezulu kuma-Micro LED. Ngesikhathi esifanayo, njengoba iphikseli ye-pixel yezikrini ze-LED iqhubeka nokuncipha, inzuzo yezindleko zobuchwepheshe be-COB iba sobala kakhulu.
5. Isifinyezo
Ngokuthuthuka okuqhubekayo kwezobuchwepheshe kanye nokuvuthwa kwemakethe, ubuchwepheshe bokupakisha be-COB kanye ne-SMD buzoqhubeka nokudlala indima ebalulekile embonini yokubonisa ezentengiso. Sinesizathu sokukholelwa ukuthi esikhathini esizayo esiseduze, lobu buchwepheshe bubili ngokuhlanganyela buzoqhubekisela phambili imboni ekuchazeni okuphakeme, izikhombisi-ndlela ezihlakaniphile, nezivumelana nemvelo.
Uma uthanda izibonisi ze-LED,xhumana nathi namuhlaukuze uthole ezinye izixazululo zesikrini se-LED.
Isikhathi sokuthumela: Jul-17-2024