1. Isingeniso ku-SMD PackAging Technology
1.1 incazelo nesizinda se-SMD
Ubuchwepheshe bokupakisha be-SMD buyindlela yokupakishwa kwezakhi ze-elekthronikhi. I-SMD, emele idivaysi ebekwe ebusweni, ubuchwepheshe obusetshenziswa kabanzi emkhakheni wezokwakha elekthronikhi ukufakwa kwama-chips ahlanganisiwe ahlanganisiwe noma ezinye izakhi ze-elekthronikhi ukuze zifakwe ngqo ebusweni bePCB (IBHODI E-PRICET PUCCITE).
1.2 Izici eziyinhloko
Usayizi omncane:Izakhi ezihlanganisiwe ze-SMD zihlangene, zinika amandla ukuhlanganiswa okuphezulu okuphezulu, okuzuzisa ukuklama imikhiqizo ye-miniaturised and lightweight ye-elekthronikhi.
Isisindo esikhanyayo:Izakhi ze-SMD azidingi ukuhola, zenze ukwakheka okulula okulula futhi kufanelekile izinhlelo zokusebenza ezidinga isisindo esincishisiwe.
Izici ezinhle kakhulu zemvamisa ephezulu:Ukuhola okufushane nokuxhumeka ezingxenyeni ze-SMD kusiza ukunciphisa ukwehla nokumelana, ukuthuthukisa ukusebenza okuvame ukwenzeka.
Ilungele ukukhiqizwa okuzenzakalelayo:Izakhi ze-SMD zilungele imishini yokufakwa ezenzakalelayo, okwandisa ukusebenza kahle kokukhiqiza kanye nokuqina kwekhwalithi.
Ukusebenza okuhle okushisayo:Izakhi ze-SMD zithintana ngqo ne-PCB Surface, engculazi ekushisweni kokushisa futhi ithuthukise ukusebenza okushisayo.
Kulula ukulungisa nokugcina:Indlela ye-Race-Mount yezakhi ze-SMD yenza kube lula ukulungisa futhi yashintshani kabusha izingxenye.
Izinhlobo zokupakisha:Ukupakishwa kwe-SMD kufaka izinhlobo ezahlukahlukene ezifana ne-SAIC, QFN, BGA, kanye ne-LGA, ngayinye enezinzuzo ezithile kanye nezimo ezisebenzayo.
Ukuthuthukiswa kwezobuchwepheshe:Kusukela ukwethulwa kwayo, ubuchwepheshe bokupakisha be-SMD buye baba ubuchwepheshe bokupakisha ojwayelekile embonini yezokwakha ngogesi. Ngokuthuthuka kwezobuchwepheshe kanye nokufunwa kwemakethe, ubuchwepheshe be-SMD buyaqhubeka nokuvela ukuze bahlangabezane nezidingo zokusebenza okuphezulu, osayizi abancane, nezindleko eziphansi.
2. Ukuhlaziywa kobuchwepheshe bokupakisha kwe-COB
2.1 Incazelo nesizinda se-cob
Ubuchwepheshe bokupakisha we-COB, obumi be-chip kwibhodi, kuyindlela yokupakisha lapho ama-chip afakwa khona ngqo kwi-PCB (ibhodi yesekethe ephrintiwe). Lobu buchwepheshe busetshenziselwa ukubhekana nezinkinga zokunciphisa ukushisa okuholwa futhi uzuze ukuhlanganiswa okuqinile phakathi kwe-chip nebhodi yokujikeleza.
2.2 Isimiso sobuchwepheshe
Ukupakishwa kwe-COB kufaka phakathi ukunamathisela ama-hasp chips engxenyeni yokuvumelanisa usebenzisa ama-adhesives asebenzayo noma angenzi-mpahla, alandelwa nge-wire bonding ukusungula ukuxhumana ngogesi. Ngesikhathi sokupakisha, uma i-chip engenalutho ivezwa umoya, ingangcoliswa noma yonakele. Ngakho-ke, ama-adhesives ajwayele ukusetshenziselwa ukuvumela i-chip kanye nezintambo zokubopha, ekwakheni "ukubekelwa phansi okuthambile."
2.3 Izici zobuchwepheshe
Ukuhlanganiswa okuhlanganisiwe: Ngokuhlanganisa ukupakisha nge-PCB, usayizi we-chip ungancishiswa kakhulu, izinga lokuhlanganiswa likhuphukile, idizayini yesifunda elenziwe kahle, ukuqina kwesifunda kwehlisiwe, nokuqina kwesifunda kwehlisiwe.
Ukuqina okuhle: I-Direct Chip Soldering ku-PCB iphumela ekuvubweni okuhle nokumelana nokushaqeka, ukugcina ukuqina ezindaweni ezinokhahlo okufana nokushisa okuphezulu kanye nomswakama, ngaleyo ndlela unwebe isikhathi sokuphila komkhiqizo.
Ukuvuselelwa okuhle kakhulu okushisayo: usebenzisa ukunamathela okushisayo okuphakathi kwe-chip ne-PCB kuthuthukisa kahle ukushiyeka kokushisa, kunciphisa umthelela we-thermal ku-chip kanye nokwenza ngcono impilo ye-chip.
Izindleko zokwenziwa okuphansi: ngaphandle kwesidingo sokuhola, kuqeda izinqubo ezithile eziyinkimbinkimbi ezibandakanya abaxhumi kanye nokuhola, ukunciphisa izindleko zokukhiqiza. Ngokwengeziwe, kuvumela ukukhiqizwa okuzenzakalelayo, ukwehlisa izindleko zabasebenzi kanye nokwenza ngcono ukusebenza kahle kokukhiqiza.
2.4 Ukuqapha
Kunzima ukulungisa: ukuthengisa okuqondile kwe-chip ku-PCB kwenza ukususwa kwe-chip ngamunye noma okunye okungenakwenzeka, ngokujwayelekile kudinga ukufakwa kwe-PCB, izindleko zokulungisa kanye nokulungisa izindleko kanye nokulungisa ubunzima.
Izinkinga ezethenjwayo: Ama-chip ashumeke ezinamatheliso angalimala ngesikhathi senqubo yokususwa, okubangela ukulimala kwe-pad kanye nekhwalithi yokukhiqiza.
Izidingo zezemvelo eziphakeme: Inqubo yokupakisha ye-COB ifuna indawo engenalo uthuli, ngaphandle komthetho; Ngaphandle kwalokho, izinga lokuhluleka liyanda.
3. Ukuqhathaniswa kwe-SMD ne-COB
Ngakho-ke, yini umehluko phakathi kwalezi zingcweti ezimbili?
3.1 Ukuqhathaniswa kwesipiliyoni esibonakalayo
Ukuboniswa kwe-COB, ngezimpawu zomthombo wokukhanya ongaphansi komhlaba, zinikezela ngababukeli ngezinto ezihlangenwe nakho okuhlosiwe futhi okufanayo. Uma kuqhathaniswa nomthombo wokukhanya kwephuzu le-SMD, i-COB inikezela ngemibala ekhanyayo kakhulu nemininingwane engcono yokuphatha, okwenza kube lula kakhulu ekubukeni isikhathi eside, okusondele.
3.2 Ukuqhathanisa ukuqina nokugcina
Ngenkathi ukuboniswa kwe-SMD kulula ukulungisa esizeni, bavikelekile ngokuphelele futhi bathambekele kakhulu ezimweni zezemvelo. Ngokuphambene nalokho, ukuboniswa kwe-COB, ngenxa yokwakheka kwawo okuphelele, kunamazinga aphezulu okuvikela, ngokusebenza okungcono kwamanzi nokusebenza okungcono. Kodwa-ke, kufanele kuqashelwe ukuthi ukuboniswa kwe-COB kuvame ukudinga ukubuyiselwa efektri ukuze kulungiswe uma kwehluleka.
3.3 ukusetshenziswa kwamandla nokusebenza kwamandla
Ngenqubo ye-Flip-Chip ye-UNobstructed Efloucted, i-COB inokusebenza komthombo wokukhanya okuphezulu, okuphumela ekusetshenzisweni kwamandla okuphansi kokukhanya okufanayo, ukonga abasebenzisi ngezindleko zikagesi.
3.4 Izindleko Nentuthuko
Ubuchwepheshe bokupakisha be-SMD busetshenziswa kabanzi ngenxa yokuvuthwa kwayo okuphezulu nezindleko zokukhiqiza eziphansi. Yize ubuchwepheshe be-COB theory ngokweqiniso bunezindleko eziphansi, inqubo yayo yokukhiqiza eyinkimbinkimbi nesilinganiso sesivuno esiphansi njengamanje kubangelwa izindleko eziphakeme kakhulu zangempela. Kodwa-ke, njengoba intuthuko yezobuchwepheshe kanye namandla okukhiqiza ayanda, izindleko ze-COB kulindeleke ukuthi zinciphe futhi.
4. Izitayela Zokuthuthuka Okuzayo
I-RTYLED uyiphayona ku-Cos Led Event Technology. -KwethuI-COB LED Ekhombisaisetshenziswa kabanziZonke izinhlobo zokuboniswa kwe-LED yezentengiselwanoNgenxa yomphumela wabo omuhle kakhulu wokubonisa kanye nokusebenza okuthembekile. I-RTEDED izibophezele ekuhlinzekeni izixazululo ezisezingeni eliphakeme, zokumisa okukodwa ukufeza izidingo zamakhasimende ethu ukuthola izikhangiso eziphezulu zencazelo kanye nokuvikelwa kwamandla nokuvikelwa kwemvelo. Siyaqhubeka nokwenza ngcono ubuchwepheshe bethu bokupakisha we-COB ukuletha amakhasimende ethu imikhiqizo yokuncintisana ngokwengeziwe ngokwenza ngcono ukusebenza komthombo wokukhanya kanye nokunciphisa izindleko zokukhiqiza. Isikrini sethu se-COB LED asigcini nje ngokuba nomphumela omuhle kakhulu wokubuka nokuqina okuphezulu, kepha futhi kungasebenza ngokuqine ezindaweni ezahlukahlukene eziyinkimbinkimbi, ukuhlinzeka abasebenzisi ngesipiliyoni esihlala isikhathi eside.
Emakethe yokubonisa yezentengiselwano yezentengiselwano, zombili i-COB ne-SMD zinezinzuzo zazo. Ngokufunwa okwandayo kwemibukiso ephezulu yencazelo, imikhiqizo yokubonisa ye-Micro ye-LED ene-pixel ephezulu ye-pixel iya ngokuya ithola ukuthandwa kwemakethe. Ubuchwepheshe beCob, ngezimpawu zayo ezihlanganiswe kakhulu, sebuphenduke ubuchwepheshe obuhle bokuthola ubuningi be-pixel ephezulu kuma-LED amancane. Ngasikhathi sinye, njengoba i-pixel pitch yezikrini eziholwa yi-LED iyaqhubeka nokuncipha, inzuzo yezindleko zobuchwepheshe be-COB iyabonakala.
5. Isifinyezo
Ngentuthuko eqhubekayo yezobuchwepheshe kanye nokuvuthwa kwemakethe, ubuchwepheshe bokupakisha be-COB kanye ne-SMD buzoqhubeka nokudlala izindima ezibalulekile embonini yezohwebo. Sinesizathu sokukholelwa ukuthi maduze nje, lobu buchwepheshe obubili buzogqugquzela imboni ekuchazeni okuphezulu, ngobuchule, kanye nemikhombandlela enobungani bezemvelo.
Uma unentshisekelo ekubonisweni kwe-LED,Xhumana nathi namuhlaNgezixazululo zesikrini esiningi.
Isikhathi sePosi: Jul-17-2024