1. Intshayelelo kwi-SMD Packaging Technology
1.1 Inkcazo kunye neNtsukaphi ye-SMD
Itekhnoloji yokupakisha ye-SMD luhlobo lokupakisha lwecandelo lombane. I-SMD, emele i-Surface Mounted Device, iteknoloji esetyenziswa ngokubanzi kwishishini lokuvelisa i-electronics ukupakisha iitshiphusi zesekethe ezidibeneyo okanye ezinye izinto ze-elektroniki ukuba zifakwe ngokuthe ngqo kumphezulu we-PCB (iBhodi yeSekethe eShicileleyo).
1.2 Iimpawu eziphambili
Ubungakanani obuncinci:Izinto ezipakishweyo ze-SMD zihlangene, zivumela ukudityaniswa koxinzelelo oluphezulu, oluluncedo ekuyileni iimveliso ze-elektroniki ezincinci kunye nezikhaphukhaphu.
Ubunzima obuKhala:Amacandelo e-SMD awafuni ukukhokela, okwenza ulwakhiwo ngokubanzi lube lula kwaye lufanelekile kwizicelo ezifuna ubunzima obuncitshisiweyo.
Iimpawu eziGqwesileyo zokuZisa okuPhakamileyo:Iindlela ezimfutshane kunye nokudibanisa kumacandelo e-SMD kunceda ukunciphisa i-inductance kunye nokuchasana, ukuphucula ukusebenza kwe-high-frequency.
Ifanelekile iMveliso eZizihambelayo:Amacandelo e-SMD afanelekile kumatshini wokubeka ngokuzenzekelayo, ukwandisa ukusebenza kakuhle kwemveliso kunye nokuzinza komgangatho.
Ukusebenza kakuhle kweThermal:Amacandelo e-SMD anxibelelana ngokuthe ngqo nomphezulu we-PCB, onceda ukutshabalalisa ubushushu kunye nokuphucula ukusebenza kwe-thermal.
Kulula ukulungisa nokugcina:Indlela yokunyuka komphezulu yamacandelo e-SMD yenza kube lula ukulungisa nokutshintsha amacandelo.
Iintlobo zokuPakisha:Ukupakishwa kwe-SMD kubandakanya iindidi ezahlukeneyo ezifana ne-SOIC, i-QFN, i-BGA, kunye ne-LGA, nganye ineenzuzo ezithile kunye neemeko ezifanelekileyo.
Uphuhliso lobuchwephesha:Ukusukela oko yaziswayo, itekhnoloji yokupakisha ye-SMD iye yaba yenye yeetekhnoloji zokupakisha eziphambili kwishishini lemveliso yombane. Ngenkqubela phambili yetekhnoloji kunye nemfuno yentengiso, itekhnoloji ye-SMD iyaqhubeka nokuvela ukuze ihlangabezane neemfuno zokusebenza okuphezulu, ubungakanani obuncinci, kunye neendleko eziphantsi.
2. Uhlalutyo lwe-COB yokuPakisha iTekhnoloji
2.1 Inkcazo kunye neMvelaphi ye-COB
Itekhnoloji yokupakisha yeCOB, emele iChip kwiBhodi, bubuchule bokupakisha apho iitshiphusi zixhonywe ngokuthe ngqo kwiPCB (iBhodi yeSekethe ePrinted). Le teknoloji isetyenziselwa ukujongana nemiba yokutshatyalaliswa kobushushu be-LED kunye nokufezekisa ukudibanisa okuqinileyo phakathi kwe-chip kunye nebhodi yesekethe.
2.2 UMmiselo woBugcisa
Ukupakishwa kwe-COB kubandakanya ukuncamathisela iitshiphusi ezingenanto kwi-substrate edibeneyo usebenzisa i-conductive okanye i-non-conductive adhesives, elandelwa yintambo yocingo ukuseka ukudibanisa kombane. Ngexesha lokupakisha, ukuba i-chip engenanto ibonakaliswe emoyeni, inokungcoliswa okanye yonakaliswe. Ke ngoko, izinto zokuncamathelisa zihlala zisetyenziselwa ukugquma itshiphu kunye neengcingo zokubopha, zenze “i-soft encapsulation.”
2.3 Iimpawu zobuGcisa
Ukupakishwa kweCompact: Ngokudibanisa ukupakishwa kunye ne-PCB, ubungakanani be-chip bungancitshiswa kakhulu, inqanaba lokudibanisa linyuswe, uyilo lwesekethe luphuculwe, ubunzima besiphaluka buthotyiwe, kunye nokuzinza kwenkqubo kuphuculwe.
Uzinzo oluLungileyo: I-chip soldering ethe ngqo kwi-PCB ibangela ukungcangcazela kakuhle kunye nokuxhathisa ukothuka, ukugcina uzinzo kwiindawo ezirhabaxa ezifana nobushushu obuphezulu kunye nokufuma, ngaloo ndlela kwandisa ubomi bemveliso.
Ukuqhuba okugqwesileyo kwe-Thermal: Ukusebenzisa i-adhesives conductive thermal conductive phakathi kwe-chip kunye ne-PCB ngokufanelekileyo kwandisa ukutshatyalaliswa kobushushu, ukunciphisa impembelelo yokushisa kwi-chip kunye nokuphucula ubomi be-chip.
Ixabiso eliphantsi lokuVelisa: Ngaphandle kwesidingo sezikhokelo, kuphelisa ezinye iinkqubo ezinzima ezibandakanya izihlanganisi kunye nezikhokelo, ukunciphisa iindleko zokuvelisa. Ukongeza, ivumela ukuveliswa okuzenzekelayo, ukunciphisa iindleko zabasebenzi kunye nokuphucula ukusebenza kakuhle.
2.4 Izilumkiso
Kunzima ukulungisa: Ukuthengiswa ngokuthe ngqo kwetshiphu kwi-PCB kwenza ukususwa kwetshiphu okanye ukutshintshwa kwetshiphu kungenzeki, ngokuqhelekileyo kufuna ukutshintshwa kwePCB yonke, ukwandisa iindleko kunye nobunzima bokulungisa.
Imiba ethembekileyo: Ii-chips ezifakwe kwi-adhesives zingonakaliswa ngexesha lokususa, ezinokubangela umonakalo we-pad kunye nokuchaphazela umgangatho wokuvelisa.
IiMfuno eziPhakamileyo zokusiNgqongileyo: Inkqubo yokupakishwa kwe-COB ifuna indawo engenathuli, i-static-free; ngenye indlela, izinga lokungaphumeleli liyenyuka.
3. Ukuthelekiswa kwe-SMD kunye ne-COB
Ke, yintoni umahluko phakathi kwezi teknoloji zimbini?
3.1 Uthelekiso lwamava aBonakalayo
Iziboniso zeCOB, ezineempawu zomthombo wokukhanya komphezulu, zibonelela ababukeli ngamava acacileyo nafanayo abonakalayo. Xa kuthelekiswa nomthombo wokukhanya we-SMD, i-COB inikezela ngemibala ecace ngakumbi kunye nokuphatha iinkcukacha ezingcono, iyenza ifaneleke ngakumbi ixesha elide, ukujongwa ngokusondeleyo.
3.2 Ukuthelekiswa kozinzo kunye nokuGcina
Ngelixa imiboniso ye-SMD kulula ukuyilungisa kwisiza, inokhuseleko olubuthathaka kwaye ichaphazeleka ngakumbi kwizinto ezisingqongileyo. Ngokwahlukileyo, iziboniso ze-COB, ngenxa yoyilo lwazo lokupakisha lulonke, zinamanqanaba aphezulu okhuseleko, kunye nokusebenza okungcono kokungena kwamanzi kunye nothuli. Nangona kunjalo, kufuneka kuqatshelwe ukuba iziboniso ze-COB zihlala zifuna ukubuyiselwa kumzi-mveliso ukuze zilungiswe kwimeko yokusilela.
3.3 UkuSetyenziswa koMbane kunye nokuSetyenziswa koMbane
Ngenkqubo ye-flip-chip engabonakaliyo, i-COB inomthombo wokukhanya ophezulu wokukhanya, okukhokelela ekusetyenzisweni kwamandla okuphantsi kokukhanya okufanayo, ukugcina abasebenzisi kwiindleko zombane.
3.4 Iindleko kunye noPhuhliso
Itekhnoloji yokupakisha ye-SMD isetyenziswa ngokubanzi ngenxa yokukhula kwayo okuphezulu kunye neendleko eziphantsi zokuvelisa. Nangona itekhnoloji ye-COB ngokwethiyori ineendleko eziphantsi, inkqubo yayo yokuvelisa entsonkothileyo kunye nezinga lesivuno esiphantsi okwangoku zikhokelela kwiindleko zokwenyani eziphezulu. Nangona kunjalo, njengoko itekhnoloji ihambela phambili kunye nomthamo wemveliso usanda, ixabiso le-COB kulindeleke ukuba lihle ngakumbi.
4. IiNdlela zoPhuhliso lwexesha elizayo
I-RTLED nguvulindlela kwitekhnoloji yokubonisa i-COB LED. YethuIziboniso ze-COB ze-LEDzisetyenziswa ngokubanzi kwizonke iintlobo zemiboniso ye-LED yorhwebongenxa yesiphumo esihle sokubonisa kunye nokusebenza okuthembekileyo. I-RTLED izibophelele ekuboneleleni ngezisombululo ezikumgangatho ophezulu, zokumisa enye ukuhlangabezana neemfuno zabathengi bethu kwimiboniso enenkcazo ephezulu kunye nokonga amandla kunye nokukhuselwa kwendalo. Siyaqhubeka nokwenza ngcono itekhnoloji yethu yokupakisha ye-COB ukuzisa abathengi bethu iimveliso ezikhuphisanayo ngokuphucula ukusebenza kakuhle komthombo wokukhanya kunye nokunciphisa iindleko zemveliso. Isikrini sethu se-COB se-LED asinayo kuphela isiphumo esihle sokubonwayo kunye nokuzinza okuphezulu, kodwa sinokusebenza ngokuzinzileyo kwiindawo ezahlukeneyo ezinzima, ukubonelela abasebenzisi ngamava ahlala ixesha elide.
Kwimarike yokubonisa i-LED, zombini i-COB kunye ne-SMD zineenzuzo zazo. Ngokunyuka kwemfuno yokubonisa inkcazo ephezulu, iimveliso zokubonisa iMicro LED ezinoxinano oluphezulu lwepixel ngokuthe ngcembe zifumana inkoliseko yentengiso. Itekhnoloji ye-COB, eneempawu zayo zokupakisha ezidityanisiweyo kakhulu, iye yaba yitekhnoloji ephambili yokufezekisa ukuxinana kwe-pixel ephezulu kwii-Micro LEDs. Kwangelo xesha, njengoko i-pixel pitch yezikrini ze-LED iqhubeka nokuhla, inzuzo yeendleko zetekhnoloji ye-COB ibonakala ngakumbi.
5. Isishwankathelo
Ngenkqubela phambili yetekhnoloji eqhubekayo kunye nokuvuthwa kweemarike, i-COB kunye ne-SMD iteknoloji yokupakisha iya kuqhubeka idlala indima ebalulekileyo kwishishini lokubonisa intengiso. Sinesizathu sokukholelwa ukuba kwikamva elingekude, ezi teknoloji zimbini ziya kuthi ngokudibeneyo ziqhubele ishishini ukuya kwinkcazo ephezulu, ekrelekrele, kunye nezalathiso ezihambelana nokusingqongileyo.
Ukuba unomdla kwiziboniso ze-LED,qhagamshelana nathi namhlanjeukufumana izisombululo ezininzi zesikrini se-LED.
Ixesha lokuposa: Jul-17-2024