I-SMD VS. I-Cob ye-Cob yePhepha lePakethi

1. Intshayelelo kwitekhnoloji yokupakisha iSMD

1.1 Ingcaciso kunye nemvelaphi ye-SMD

Itekhnoloji yokupakisha ye-SMD yindlela yokupakisha yecandelo le-elektroniki. I-SMD, emele isixhobo esikhuselweyo, sisetyenziswa ngokubanzi kwi-eleklikhi yemveliso ye-elektroniki yokufaka i-chipsing ehlanganisiweyo okanye ezinye izinto ze-elektroniki ziphakame ngqo kumphezulu we-PCB (iBhodi yeSekethe eprintiweyo).

1.2 Iimpawu eziphambili

Ubuncinci:Izinto ezifakelweyo ze-SMD ze-compact, ukunika amandla okudityaniswa okuphezulu, okuyingenelo ukuyila iimveliso ze-elektroniki ezincinci kunye nezikhanyayo.

Ubunzima bokukhanya:Izinto ze-SMD azifuni kukhokelela, zenza isakhiwo siphela silula kwaye silungele izicelo ezifuna ubunzima.

Iimpawu eziphezulu ze-RightIzikhokelo ezimfutshane kunye noqhagamshelo kwizixhobo ze-SMD zinceda ukunciphisa ukungahambi kakuhle nokunyangwa, ukuphucula ukusebenza okuphezulu.

Imveliso efanelekileyo kwimveliso ezenzekelayo:Izinto ze-SMD zilungele oomatshini bokufakwa ngokuzenzekelayo, ukwanda kokusebenza kwemveliso kunye nokuzinza komgangatho.

Umsebenzi olungileyo we-thermal:Izinto ze-SMD zinxibelelana ngokuthe ngqo nomphezulu wePCB, zeziphi izinto zikaGawulayo zokungasebenzi kakuhle kwaye ziphucula ukusebenza kwe-thermal.

Kulula ukulungisa nokugcina:Indlela yeNdlela yeNdawo yeSMD yenza kube lula ukulungisa kwaye ithathe indawo yezinto.

Iindidi zokupakisha:Ukupakisha i-SMD kubandakanya iintlobo ngeentlobo zeSotic, i-QFN, i-BGA, kunye ne-LG, nganye ineengenelo ezithile kunye nemeko efanelekileyo.

Uphuhliso lwetekhnoloji:Oko Intshayelelo yayo, itekhnoloji yokupakisha i-SMD iye yaba yenye yeetekhnoloji zokupakisha okwindlela ephambili kwishishini lemigaqo ye-elektroniki elengliki. Ngenkqubela phambili kwezobuchwephesha kunye nemfuno yentengiso, itekhnoloji ye-SMD iyaqhubeka ukuveza iimfuno zomsebenzi ophakamileyo, ubungakanani abancinci, kunye neendleko eziphantsi.

2. Uhlalutyo lwetekhnoloji yokupakisha

2.1 Ingcaciso kunye nemvelaphi ye-cob

Itekhnoloji yokupakisha i-Cob, emele i-chip ebhodini, yindlela yokupakisha apho iitshipsi zifakwe ngqo kwi-PCB (iBhodi yeSekethe eprintiweyo). Le teknoloji isetyenziselwa ukujongana nemicimbi yokuhlela ye-LED yokukhokelela ebusweni kwaye ifezekise ukudityaniswa okuqinileyo phakathi kweChip kunye neBhodi yeSiphako.

2.2 Umgaqo wezobuGcisa

Ukupakisha i-Cob kubandakanya ukunamathela kwii-chips ezingenanto kwi-chips edibeneyo kusetyenziswa amachaphaza ahambayo okanye angabinayo, kulandelwe yi-wire wire wire yokubonisa unxibelelwano lombane. Ngexesha lokupakishwa, ukuba i-chip engenanto ityhilwe emoyeni, inokungcoliseka okanye yonakele. Ke ngoko, amabhabhusa ahlala esetyenziselwa ukwenza i-chip kunye ne-cingo ye-boler, enza i-engecation "ethambileyo."

2.3 Iimpawu zezobuchwephesha

Ukupakisha ngokulandelelana

Uzinzo oluhle: Ukuthengiswa kwe-chip ngokuthe ngqo kwi-PCB kubangela ukungavisisani okulungileyo kunye nokunganyangeki kokothusayo, ukugcina uzinzo kwiindawo ezinobushushu kunye nokufuma, ngaloo ndlela kudlulisa imveliso.

Ukuqhubela phambili kwe-hormac egqwesileyo: ukusebenzisa amaphiko aphezulu okuhamba nge-ship phakathi kwe-chip kunye ne-PCB ukuphucula ukubekwa kwe-chip kunye ne-CHBB enciphisa ifuthe le-CHIP kunye nokuphucula i-chip desvespan.

Ixabiso lemveliso eliphantsi: Ngaphandle kwemfuno yokukhokelela, isusa ezinye iinkqubo ezintsonkothileyo ezibandakanya iziqendu kunye nokukhokelela, ukunciphisa iindleko zokwenza izinto. Ukongeza, ivumela ukuveliswa okuzenzekelayo, ukunciphisa iindleko kunye nokuphucula ukusebenza kwemveliso.

2.4 amanyathelo okhuseleko

Kunzima ukulungisa: Ukungeniswa ngokuthe ngqo kwe-chip kwi-PCB kwenza ukufuduswa kwe-chip okanye ukutshintshwa kwenzeke, ngokufuna ukutshintshwa kuyo yonke i-PCB yonke, ukunyuka kweendleko kunye nobunzima.

Imicimbi yokuthembeka: Iitshipsi ezingeniswe kwiindawo ezinamadyole zinokonakala ngexesha lenkqubo yokukhupha, inokubangela ukonakaliswa kwepad kunye nokuchaphazela umgangatho wemveliso.

Iimfuneko eziphezulu zokusiNgqongileyo: Inkqubo yokupakisha i-Cob ifuna indawo engenamfihlo engenasimahla; Ngaphandle koko, inqanaba lokusilela liyanda.

3. Thelekisa i-SMD kunye ne-cob

Ke, yintoni umahluko phakathi kwezi teknoloji zimbini?

3.1 Ukuthelekisa amava abonakalayo

I-Cob ibonakalisa, ngeempawu zazo zokukhanya ezikhanyayo, zibonelela ababukeli ngamava acocekileyo kunye nawo ngakumbi amava abonakalayo. Xa kuthelekiswa nomthombo wokukhanya okukhanya kwe-SMD, i-COB ibonelela ngemibala ecacileyo kunye nokuphatha kakuhle, kokwenza kube lifaneleke ngakumbi kwixesha elide, elisondeleyo.

3.2 Thelekisa uzinzo kunye nokulondolozwa

Ngelixa ukuboniswa kwe-SMD kulula ukulungisa indawo, bakhusela ubukhulu becala kwaye banomdla ngakumbi kwizinto zokusingqongileyo. Ngokwahlukileyo, ukuboniswa kwe-COB, ngenxa yoyilo lwabo ngokubanzi, banamanqanaba aphezulu okhuselo, kunye nokusebenza okungcono kwamanzi kunye nokusebenza kothuli. Nangona kunjalo, kufuneka kuqatshelwe ukuba ii-cobs zibonisa ukuba zifunelwa ukuba zibuyiselwe kumzi-mveliso ukuze zilungiswe kwimeko yokusilela.

3.3 Ukusetyenziswa kwamandla kunye nokusebenza kakuhle kwamandla

Ngenkqubo ye-chip-chip-i-chip-i-cob inomthombo wokukhanya okuphezulu, okukhokelela ekusetyenzisweni kwamandla okuqaqambe kokukhanya okufanayo, abasebenzisi kwiindleko zombane.

3.4 Ixabiso kunye nophuhliso

Itekhnoloji yokupakisha iSMD isetyenziswa ngokubanzi ngenxa yokuvuthwa okuphezulu kunye neendleko eziphantsi zemveliso. Nangona iteknoloji ye-IOB ineendleko eziphantsi, inkqubo yayo yokwenza ubunzulu kunye nereyithi yesivuno ephantsi yangoku nje ikhokelela kwiindleko eziphezulu. Nangona kunjalo, njengoko inkqubela phambili yetekhnoloji kunye nemveliso yokwanda, iindleko ze-cob kulindeleke ukuba zinciphe.

I-4. Iindlela zophuhliso lwexesha elizayo

Irhabaxa nguvulindlela kwi-Cob yeTekhnoloji ye-LOB ye-LED. BethuI-Cob ye-LEDzisetyenziswe ngokubanzi ngaphakathiZonke iintlobo zemiboniso ye-LED ye-LEDNgenxa yefuthe labo lokubonisa kunye nentsebenzo ethembekileyo. Irm Siyaqhubeka nokwenza itekhnoloji yethu yepakethi yokungenisa abathengi bethu iimveliso ezinokhuphiswano ngakumbi ngokuphucula umthombo wokukhanya kunye nokunciphisa iindleko zemveliso. I-COB yethu ye-LED ayinayo kuphela ifuthe elihle kunye nozinzo oluphezulu, kodwa linokusebenza ngeendawo ezahlukeneyo, zinokubonelela ngeendawo ezinabantu abaninzi, zinika abasebenzisi ngamava ahlala ixesha elide.

Kwintengiso yentengiso ye-LED, zombini i-Cob kunye ne-SMD zinezibonelelo zabo. Ngemfuno eyandayo yokuboniswa kwenkqubo, iimveliso ezibonisa i-LED ye-LED ene-pixel ephezulu ye-pixel ifumana ingqalelo ngokuthe ngcembe. Itekhnoloji ye-COB, iimpawu zayo zokupakisha ezihlanganisiweyo, sele itekhnoloji ephambili yokufezekisa uxinano oluphezulu lwe-pixel kwii-leds ezincinci. Kwangelo xesha, njengoko i-pixel ye-pixel yezikrini ze-LED iyaqhubeka, inzuzo yeendleko yetekhnoloji ye-COB iya kuba ibonakala ngakumbi.

5. Isishwankathelo

Ngenkqubela phambili eqhubekayo yobuchwephesha kunye nokuqulunqwa kwentengiso, iitekhnoloji zokupakisha ii-SMD ziya kuqhubeka nokudlala iindima ezibalulekileyo kwishishini lokubonisa lorhwebo. Sinesizathu sokukholelwa ukuba kungekudala, ezi teknoloji zimbini ziya kulungiselela ngokudibeneyo ishishini malunga nengcaciso ephezulu, ubuchule, kunye nokusingqongileyo okusingqongileyo.

Ukuba unomdla kwimiboniso ye-LED,Nxibelelana nathi namhlanjekwizisombululo ze-LED ye-LED.