1. Hoʻolauna
I ka laha nui ʻana o nā noi pale hōʻike LED, ua hoʻonui ʻia nā koi no ka maikaʻi o ka huahana a me ka hana hōʻike. ʻAʻole hiki i ka ʻenehana SMD kuʻuna ke hoʻokō i nā pono o kekahi mau noi. No laila, ke neʻe nei kekahi mau mea hana i nā ʻano encapsulation hou e like me ka ʻenehana COB, aʻo nā mea ʻē aʻe e hoʻomaikaʻi ana i ka ʻenehana SMD. ʻO ka ʻenehana GOB kahi ʻike o ka hoʻomaikaʻi ʻana i ke kaʻina hana encapsulation SMD.
Ua hoʻomohala ka ʻoihana hōʻike LED i nā ʻano encapsulation like ʻole, me nā hōʻike COB LED. Mai ka ʻenehana DIP (Direct Insertion Package) ma mua i ka ʻenehana SMD (Surface-Mount Device), a laila i ka puka ʻana o COB (Chip on Board) encapsulation, a ma hope o ka hiki ʻana mai o GOB (Glue on Board) encapsulation.
Hiki i ka ʻenehana GOB ke hoʻohana i nā noi ākea no nā pale hōʻike LED? He aha nā ʻano e hiki ai iā mākou ke manaʻo i ka hoʻomohala ʻana o ka mākeke o GOB? E neʻe kāua.
2. He aha ka GOB Encapsulation Technology?
2.1Hōʻike LED GOBʻO ia ka pale hōʻike LED pale nui, hāʻawi i ka wai ʻole, ka moisture-proof, impact-resistant, dustproof, corrosion-resistant, blue light-resistant, paakai-kūʻai, a anti-static hiki. ʻAʻole lākou e hoʻopilikia i ka wela a i ʻole ka nalowale ʻana o ka mālamalama. Hōʻike ka hoʻāʻo nui ʻana i ke kolu i hoʻohana ʻia ma GOB i ke kōkua ʻana i ka wela wela, e hōʻemi ana i ka helu hemahema o nā LED, hoʻonui i ka paʻa o ka hōʻike, a pēlā e hoʻonui ai i kona ola.
2.2 Ma o ke kaʻina hana GOB, ua hoʻololi ʻia nā kiko kiko kiko ma mua o ka ʻili o ka pale GOB LED i ʻili paheʻe a palahalaha, e loaʻa ai ka hoʻololi ʻana mai ke kumu kukui a i ke kumu kukui ili. ʻO kēia ka mea i ʻoi aku ka like o ka hoʻokuʻu māmā ʻana o ka pale pale LED a ʻoi aku ka maʻalahi o ka hopena hōʻike. Hoʻonui nui ia i ke kihi nānā (kokoke i 180° horizontally a vertically), hoʻopau pono i nā ʻano moiré, hoʻomaikaʻi nui i ka ʻokoʻa o ka huahana, hoʻemi i ka ʻālohilohi a me nā hopena ʻālohilohi, a hoʻopau i ka luhi ʻike.
3. He aha ka COB Encapsulation Technology?
ʻO ka hoʻopili ʻana o COB ʻo ia ka hoʻopili pololei ʻana i ka chip i ka substrate PCB no ka pili uila. Ua hoʻolauna mua ʻia e hoʻoponopono i ka pilikia dissipation wela o nā pā wikiō LED. Hoʻohālikelike ʻia me DIP a me SMD, ʻike ʻia ka encapsulation COB e ka mālama ʻana i ka lewa, nā hana encapsulation maʻalahi, a me ka hoʻokele wela maikaʻi. I kēia manawa, hoʻohana nui ʻia ka encapsulation COBhōʻike LED pitch maikaʻi.
4. He aha nā pono o ka COB LED Display?
Māmā a lahilahi:Wahi a nā mea kūʻai aku, hiki ke hoʻohana ʻia nā papa PCB me nā mānoanoa mai 0.4 a 1.2mm, e hōʻemi ana i ke kaumaha a hiki i ka hapakolu o nā huahana kuʻuna, me ka hoʻohaʻahaʻa nui ʻana i nā kumu kūʻai, ka lawe ʻana, a me ka ʻenekinia.
Ka hopena a me ke kū'ē i ke kaomi:Hoʻopili pololei ka hōʻike COB LED i ka chip LED i ke kūlana concave o ka papa PCB, a laila hoʻopili a hoʻōla iā ia me ke kāpili epoxy resin. Hoʻopuka ka ʻili o ke kiko māmā, ʻoluʻolu a paʻakikī, paʻa i ka hopena, a paʻa i ka lole.
ʻO ka huina nānā ākea:Hoʻohana ʻo COB encapsulation i ka hoʻokuʻu kukui spherical pāpaʻu, me kahi kihi nānā i ʻoi aku ma mua o 175 degere, kokoke i 180 degere, a loaʻa nā hopena kukui diffused maikaʻi loa.
ʻO ka hoʻoheheʻe wela ikaika:Hoʻopili ka pale COB LED i ke kukui ma ka papa PCB, a ʻo ka pahu keleawe ma ka papa PCB e alakaʻi koke i ka wela o ke kumu kukui. ʻO ka mānoanoa keleawe o ka papa PCB he koʻikoʻi kaʻina hana, i hui pū ʻia me nā kaʻina hana gula-plating, kokoke e hoʻopau i ka attenuation māmā. No laila, liʻiliʻi nā kukui make, e hoʻolōʻihi i ke ola.
Kūleʻa a maʻalahi ke hoʻomaʻemaʻe:ʻO nā pale COB LED ka ʻili o ke kiko kukui e puka i loko o ke ʻano spherical, e maʻalahi a paʻakikī, paʻakikī a paʻa i ka ʻaʻahu. Inā ʻike ʻia kahi wahi ʻino, hiki ke hoʻoponopono ʻia i kēlā me kēia kiko. ʻAʻohe mask, a hiki ke hoʻomaʻemaʻe ʻia ka lepo me ka wai a i ʻole ka lole.
ʻO ka maikaʻi o ka wā a pau:Hāʻawi ka mālama mālama ʻekolu i ka wai kūwaho, ka moisture-proof, corrosion-proof, dustproof, anti-static, oxidation, a me ka pale UV. Hiki iā ia ke hana maʻamau i nā wahi wela mai -30°C a 80°C.
5. He aha ka ʻokoʻa ma waena o COB a me GOB?
Aia ka ʻokoʻa nui ma waena o COB a me GOB i ke kaʻina hana. ʻOiai ʻo ka COB encapsulation he ʻili maʻemaʻe a ʻoi aku ka maikaʻi o ka pale ma mua o ka encapsulation SMD kuʻuna, hoʻohui ʻo GOB encapsulation i kahi kaʻina noi glue i ka ʻili o ka pale, hoʻonui i ka paʻa o nā kukui LED a hoʻemi nui i ka hiki ke hāʻule nā mālamalama, e hoʻoikaika i ka paʻa.
6. ʻO wai ka mea ʻoi aku ka maikaʻi, COB a i ʻole GOB?
ʻAʻohe pane paʻa i ka mea ʻoi aku ka maikaʻi, hōʻike COB LED a i ʻole GOB LED hōʻike, ʻoiai ke ʻano o ka ʻenehana encapsulation e pili ana i nā kumu like ʻole. ʻO ka noʻonoʻo koʻikoʻi inā ʻoe e koho mua i ka pono o nā kukui LED a i ʻole ka pale i hāʻawi ʻia. Loaʻa i kēlā me kēia ʻenehana encapsulation kona mau pono a ʻaʻole hiki ke hoʻokolokolo ʻia ma ke ao holoʻokoʻa.
Ke koho nei ma waena o COB a me GOB encapsulation, he mea nui e noʻonoʻo i ke ʻano hoʻonohonoho a me ka manawa hana. Hoʻopili kēia mau mea i ka hoʻokele kumukūʻai a me nā ʻokoʻa o ka hana hōʻike.
7. hopena
Hāʻawi nā ʻenehana encapsulation GOB a me COB i nā pono kūʻokoʻa no nā hōʻike LED. Hoʻonui ka GOB encapsulation i ka pale a me ka paʻa o nā kukui LED, e hāʻawi ana i ka wai maikaʻi loa, ka lepo lepo, a me nā waiwai anti-collision, me ka hoʻomaikaʻi ʻana i ka wela a me ka hana ʻike. Ma ka ʻaoʻao ʻē aʻe, ʻoi aku ka maikaʻi o ka encapsulation COB i ka mālama ʻana i ka lewa, ka hoʻokele wela maikaʻi, a me ka hāʻawi ʻana i kahi hopena māmā a me ka hopena. ʻO ka koho ma waena o COB a me GOB encapsulation e pili ana i nā pono kikoʻī a me nā mea nui o ka hoʻonohonoho hoʻonohonoho ʻana, e like me ka lōʻihi, ka mālama kumu kūʻai, a me ka maikaʻi hōʻike. Loaʻa i kēlā me kēia ʻenehana kona ikaika, a pono e hoʻoholo ʻia ma muli o ka loiloi piha ʻana o kēia mau kumu.
Inā pilikia ʻoe i kekahi ʻano,e kelepona mai iā mākou i kēia lā.RTLEDua kūpaʻa ʻo ia i ka hāʻawi ʻana i nā hopena hōʻike LED maikaʻi loa.
Ka manawa hoʻouna: ʻAukake-07-2024